| Product Name | Large bonded fin heatsink 400(W)*114(H)*500(L)mm |
| Material | AL 6063 T5;AL 1100 |
| Detailed Size | As per customers' design,max width 1000mm,max height 200mm,min gap 2mm |
| Advantage | Flexible pitch, height and width,manufactured without molds;smaller volume and lightweight,an ideal selection for cooling high power devices |
| Sample Service | Samples with differernt sizes can be availabe for prototypes test within 1 week |
| Production Process | Aluminum plate cutting---Making the solts in the base---Fins cutting--Bonding fins to base---CNC Machining---Deburring--- Cleaning--- Inspecting--Packing |
| Surface Treatment | Degreasing,(Black) Anodizing,Sand Blasting,Painting,Chromating and Laser marking |
| Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
| Experience | More than 20 years professional manufacturing experience |
| | LED Lighting,Inverter,Welding Machine,Communication Device,Power Supply Equipment,Electronic Industry,Thermoelectric Coolers/Generator,IGBT/UPS Cooling Systems,etc. |
Introduction:
Size and shape: Electronic heat sinks come in various shapes and sizes, depending on the specific application requirements. The size and shape of the heat sink can affect its cooling efficiency and the amount of space required for installation.
Material: Electronic heat sinks are typically made from thermally conductive materials such as aluminum or copper, which have high thermal conductivity to allow heat to be transferred away from the component. Other materials such as graphite or diamond can also be used for higher performance applications.
Electronic heat sinks are commonly used in electronic devices such as computers, televisions, and mobile phones, as well as in industrial and automotive applications. They are essential for preventing electronic components from overheating and malfunctioning, which can lead to reduced performance, shortened lifespan, and even permanent damage.
Advantages:
A water cooling heatsink is a type of heat sink that uses water as a cooling medium instead of air. It typically consists of a metal base, such as copper or aluminum, with channels or tubes running through it that allow water to flow through. The water absorbs heat from the heat source, such as a CPU or graphics card, and then is circulated away from the heatsink to a radiator, where the heat is dissipated into the surrounding environment.
